Mohlo by se vám také líbit

Více informací o knize Three Dimensional System Integration

• Parametry knihy
• Anotace
• Oblíbené z jiného soudku

Nákupem získáte 168 bodů

Anotace knihy

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. §§This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Plný název: Three Dimensional System Integration
• Podnázev: IC Stacking Process and Design
• Autor: Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 246
• EAN: 9781441909619
• ISBN: 1441909613
• ID: 01420524
• Nakladatelství: Springer-Verlag New York Inc.
• Hmotnost: 1190 g
• Rozměry: 235 × 155 × 23 mm
• Datum vydání: 01. January 2010

Oblíbené z jiného soudku

---

---

---