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Více informací o knize Stress Induced Phenomena in Metallization

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• Anotace
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Anotace knihy

Tiny metal structures, less than a millionth of a meter across, are critical building blocks in a number of high-tech devices such as computer chips. These "metallizations" are subjected to extreme conditions of temperature, electric current density, and mechanical load, which may cause the device they are in to fail. This book contains research papers on these metallizations and on the reliability problems associated with them. The papers were peer reviewed for these proceedings.

Parametry knihy

• Plný název: Stress Induced Phenomena in Metallization
• Podnázev: Sixth International Workshop on Stress Induced Phenomena in Metallization, Ithaca, New York, 25-27 July 2001
• Autor: Shefford P. Baker, Matti A. Korhonen, Eduard Arzt, Paul S. Ho
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 250
• EAN: 9780735400580
• ID: 01390770
• Nakladatelství: Springer, Berlin
• Hmotnost: 590 g
• Rozměry: 235 × 155 mm
• Rok vydání: 2002

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