Kód: 06721699
Semiconductor Packaging
Autor Randy Hsiao-Yu Lo
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a f ... celý popis
- Jazyk:
Angličtina - Vazba: Pevná
- Počet stran: 216
Nakladatelství: Taylor & Francis Inc, 2011
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Anotace knihy
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundame
Parametry knihy
Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering
6995 Kč
- Plný název: Semiconductor Packaging
- Podnázev: Materials Interaction and Reliability
- Autor: Randy Hsiao-Yu Lo
- Jazyk: Angličtina
- Vazba: Pevná
- Počet stran: 216
- EAN: 9781439862056
- ISBN: 9781439862056
- ID: 06721699
- Nakladatelství: Taylor & Francis Inc
- Hmotnost: 472 g
- Rozměry: 241 × 156 × 17 mm
- Datum vydání: 10. October 2011
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