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Více informací o knize Reliability Technology for Integrated Circuit Packaging

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Anotace knihy

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.

Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.

Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

Parametry knihy

Zařazení knihy Knihy v němčině Naturwissenschaften, Medizin, Informatik, Technik Technik Bau- und Umwelttechnik

• Plný název: Reliability Technology for Integrated Circuit Packaging
• Autor: Yunfei En, Si Chen
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 509
• EAN: 9789819538843
• ISBN: 981953884X
• ID: 49699488
• Nakladatelství: Springer-Verlag GmbH
• Hmotnost: 1010 g
• Datum vydání: 13. March 2026

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