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Více informací o knize Optimal Interconnect Networks for 2D and 3D Microchips

• Parametry knihy
• Anotace
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Anotace knihy

We are today in the era of gigascale 2D and 3D §integrated circuits. These microchips are typically §considered to be "interconnect limited", with §performance limited by signal, power, clock and §thermal interconnect networks. Techniques to tackle §this interconnect challenge are proposed and §quantitatively evaluated in this book. Topics §described by the author include integrated §microchannel cooling of 3D stacked dice, repeater §insertion models, carbon nanotube interconnects, §parallel processing architectures, electromigration §avoidance methods and a CAD tool to co-design §signal, power, clock and thermal interconnect §networks of microchips. This book should be §especially useful to students and professionals in §the areas of microelectronics, VLSI design, §packaging and computer architecture.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Technology: general issues

• Plný název: Optimal Interconnect Networks for 2D and 3D Microchips
• Autor: Deepak Sekar
• Jazyk: Angličtina
• Vazba: Brožovaná
• Počet stran: 144
• EAN: 9783639073959
• ISBN: 3639073959
• ID: 06816661
• Nakladatelství: VDM Verlag
• Hmotnost: 222 g
• Rozměry: 229 × 152 × 9 mm
• Datum vydání: 01. March 2009

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