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Více informací o knize Modeling and Simulation for Microelectronic Packaging Assembly

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Anotace knihy

Teaches the skills needed to shorten the time for design, manufacturing, reliability, and testing of microelectronic package assembly§Liu and Liu begin with an overview of mechanics and modeling, including modeling validation tools and an explanation of concurrent engineering. They then move on to modeling in microelectronic packaging and assembly, coving packaging and assembly for typical ICs, optoelectronics, MEMS, SIP/3D, and nano interconnects. The next section explains modeling methods for package reliability and test, followed my modern modeling and simulation methodologies.§Models and simulates numerous processes in manufacturing, reliability and testing for the first time§Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing§Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products.§Subroutines and color images available for download from the books Companion Site

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Mechanical engineering & materials Production engineering

• Plný název: Modeling and Simulation for Microelectronic Packaging Assembly
• Podnázev: Manufacturing, Reliability and Testing
• Autor: Sheng Liu, Yong Liu
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 592
• EAN: 9780470827802
• ISBN: 0470827807
• ID: 01388967
• Nakladatelství: John Wiley & Sons Inc
• Hmotnost: 942 g
• Rozměry: 247 × 173 × 35 mm
• Datum vydání: 21. October 2011

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