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Více informací o knize Low Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHz

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Anotace knihy

This work presents a low temperature co-fired ceramic (LTCC) technology based system-in-package (SiP) operating beyond 100 GHz. The SiP encloses a semiconductor transceiver chip in a pea-sized LTCC package. The SiP is efficient and robust in terms of its electrical, thermal and mechanical characteristics. Moreover, it is low-cost and requires only standard manufacturing and assembly techniques. Finally, two fully-integrated 122 GHz radar sensors are demonstrated in LTCC technology.

Parametry knihy

• Plný název: Low Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHz
• Jazyk: Angličtina
• Vazba: Brožovaná
• Počet stran: 254
• EAN: 9783731509455
• ISBN: 3731509458
• ID: 25007313
• Nakladatelství: Karlsruher Institut für Technologie
• Hmotnost: 373 g
• Rozměry: 210 × 148 × 16 mm
• Datum vydání: 22. October 2019

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