Mohlo by se vám také líbit

Informovat o naskladnění knihy

Více informací o knize Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

• Parametry knihy
• Anotace
• Oblíbené z jiného soudku

Nákupem získáte 476 bodů

Anotace knihy

This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics.The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Plný název: Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
• Autor: John H. Lau
• Jazyk: Angličtina
• Vazba: Pevná
• EAN: 9789819721399
• ID: 45205811
• Nakladatelství: Springer, Berlin
• Rozměry: 235 × 155 mm
• Datum vydání: 11. September 2024

---

---

---