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Více informací o knize Development of Sub-mm Wave Flip-Chip Interconnect

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Anotace knihy

With the increasing availability of MMICs at high frequencies beyond 100 GHz low-loss interconnects for module fabrication become essential. This work presents the results of the flip-chip interconnects approach exhibiting bandwidths from 220 GHz up to 500 GHz. Flip-chip transitions in this study were fabricated based on simulated 3D models in three different topologies: coplanar-to-coplanar, stripline-to-coplanar, and stripline-to-stripline. The interconnects were realized with 10 µm-diameter AuSn microbumps. After the flip-chip mounting, scattering parameter measurements were performed to characterize the interconnect quality. The results suggest that the flip-chip technology is currently the most suitable technology for the high frequency range.

Parametry knihy

• Plný název: Development of Sub-mm Wave Flip-Chip Interconnect
• Autor: Sinipa Monayakul
• Jazyk: Angličtina
• Vazba: Brožovaná
• Počet stran: 131
• EAN: 9783736994102
• ISBN: 3736994109
• ID: 15700053
• Nakladatelství: Cuvillier Verlag
• Hmotnost: 202 g
• Rozměry: 210 × 148 × 8 mm
• Datum vydání: 13. December 2016

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