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Více informací o knize Chemical-Mechanical Polishing 2000 - Fundamentals and Materials Issues: Volume 613

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Anotace knihy

Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. Topics include: CMP mechanisms; dielectric and metal CMP; process integration and manufacturability; and CMP consumables.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Plný název: Chemical-Mechanical Polishing 2000 - Fundamentals and Materials Issues: Volume 613
• Autor: Rajiv K. Singh, Rajeev Bajaj, Mansour Moinpour, Marc Meuris
• Jazyk: Angličtina
• Vazba: Brožovaná
• Počet stran: 176
• EAN: 9781107413146
• ISBN: 1107413141
• ID: 02439353
• Nakladatelství: Cambridge University Press
• Hmotnost: 24 g
• Rozměry: 229 × 152 × 10 mm
• Datum vydání: 05. June 2014

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