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Více informací o knize Chemical-Mechanical Planarization: Volume 867

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Anotace knihy

Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Technology: general issues Engineering: general

• Plný název: Chemical-Mechanical Planarization: Volume 867
• Podnázev: Integration, Technology and Reliability
• Autor: E. C. Johns, A. Kumar, J. a. Lee
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 302
• EAN: 9781558998209
• ISBN: 1558998209
• ID: 02060414
• Nakladatelství: Materials Research Society
• Datum vydání: 19. July 2005

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