Kód: 02060217
This volume, the newest in a series dedicated to leading-edge research for advanced metallization in integrated circuit applications, represents an industry milestone by switching to Cu-based metallization. The conference, which o ... celý popis
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This volume, the newest in a series dedicated to leading-edge research for advanced metallization in integrated circuit applications, represents an industry milestone by switching to Cu-based metallization. The conference, which originated as Tungsten Workshop in the early 1980s, was later changed to Advanced Metallization and Interconnect Systems for ULSI Applications. It has now been renamed once again, this time to Advanced Metallization Conference (AMC), in order to better represent its expanded scope. The volume features two keynote addresses -- one on "Shift to Copper and Low-k at SEMATECH", the other on "ULSI Scaling and Interconnect Technology".
Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Mechanical engineering & materials Materials science
717 Kč
Osobní odběr Praha, Brno a 12903 dalších
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