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Více informací o knize Advanced Metallization Conference 2001 (AMC 2001): Volume 17

• Parametry knihy
• Anotace
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Anotace knihy

Leading-edge advanced metallization schemes, as applied to VLSI interconnects, include the introduction of novel metals systems and novel dielectric materials. Technological advances highlighted at AMC 2001 include the latest developments in integrating copper metallization with low-dielectric constant materials, and evaluations of the reliability of such interconnects. Recently, in both industry and academia there has been increased interest in basic research as applied to the field of vertical integration. Since the problems that affect vertical integration are similar to those of VLSI interconnects, it is natural to include the topic here. In fact, it is anticipated that cross fertilization between the fields of VLSI metallization and vertical interconnect will yield a viable technical solution to the problem of multichip integration. This book offers a comprehensive look at the current state of the art of VLSI interconnects. Topics include: process integration; vertical integration and advanced packaging; copper metallization; low-K dielectrics technology; modeling; reliability; barriers; atomic-layer epitaxy and other technologies; and CMP and automation.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Plný název: Advanced Metallization Conference 2001 (AMC 2001): Volume 17
• Autor: A. J. McKerrowY. Sacham-DiamandS. ZaimaT. Ohba
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 719
• EAN: 9781558996700
• ISBN: 1558996702
• ID: 02060334
• Nakladatelství: Materials Research Society
• Hmotnost: 1110 g
• Rozměry: 235 × 159 × 42 mm
• Datum vydání: 01. January 2002

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