Kód: 09043704
3D IC Integration and Packaging
Autor John Lau
A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications
- Jazyk:
Angličtina - Vazba: Pevná
- Počet stran: 480
Nakladatelství: McGraw-Hill Education - Europe, 2015
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Anotace knihy
A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications
Parametry knihy
Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering
5017 Kč
- Plný název: 3D IC Integration and Packaging
- Autor: John Lau
- Jazyk: Angličtina
- Vazba: Pevná
- Počet stran: 480
- EAN: 9780071848060
- ISBN: 9780071848060
- ID: 09043704
- Nakladatelství: McGraw-Hill Education - Europe
- Hmotnost: 1028 g
- Rozměry: 245 × 196 × 28 mm
- Datum vydání: 27. August 2015
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