Mohlo by se vám také líbit

Více informací o knize Three-Dimensional Integration of Semiconductors

• Parametry knihy
• Anotace
• Oblíbené z jiného soudku

Nákupem získáte 230 bodů

Anotace knihy

This book starts with background concerning three-dimensional interconnects - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. Then it covers their numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others.§The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Plný název: Three-Dimensional Integration of Semiconductors
• Podnázev: Processing, Materials, and Advanced Applications
• Autor: Kazuo Kondo, Morihiro Kada, Kenji Takahashi
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 408
• EAN: 9783319186740
• ISBN: 3319186744
• ID: 09266952
• Nakladatelství: Springer International Publishing AG
• Hmotnost: 7627 g
• Rozměry: 235 × 155 × 245 mm
• Datum vydání: 09. December 2015

Oblíbené z jiného soudku

---

---

---