Kód: 43659892
This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretic ... celý popis
Nákupem získáte 429 bodů
This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.
Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Energy technology & engineering Electrical engineering
4290 Kč
Osobní odběr Praha, Brno a 12903 dalších
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