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Více informací o knize Simulation of Deep Drawing Die for Optimizing Die Corner Radius

• Parametry knihy
• Anotace
• Oblíbené z jiného soudku

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Anotace knihy

In today's world manufacturing industry gained potential in manufacturing precision components with accurate dimensions. In order to produce precise components, one has to design the system in an optimal way. Many analysis software's are available in the market to analyze the stresses induced during manufacturing processes. It is the responsibility of the designers to minimize those stresses by proper selection of work piece material and tools. In the present book design and analysis on deep drawing die is presented as a case study and the same can be implemented for other forming processes.

Parametry knihy

• Plný název: Simulation of Deep Drawing Die for Optimizing Die Corner Radius
• Autor: Siva Prasad Kondapalli
• Jazyk: Angličtina
• Vazba: Brožovaná
• Počet stran: 100
• EAN: 9783659840760
• ID: 14115177
• Nakladatelství: Scholars Press
• Hmotnost: 165 g
• Rozměry: 220 × 150 × 6 mm
• Rok vydání: 2016

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