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Anotace titulu

The Microelectronics Packaging Handbook continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing processes. Now available on CD-ROM for the first time, it discusses state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a navigational scheme for easy access to content, hypertext links for glossary terms, references, footnotes and graphics, and full text search capabilities for more powerful querying of the information.

Parametry titulu

Zařazení titulu Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Plný název: Microelectronics Packaging Handbook on CD-ROM
• Autor: Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
• Jazyk: Angličtina
• Vazba: CD
• Počet stran: 1000
• EAN: 9780412085611
• ISBN: 0412085615
• ID: 05248292
• Nakladatelství: Chapman and Hall
• Hmotnost: 296 g
• Rozměry: 178 × 174 × 30 mm
• Datum vydání: 01. March 1998

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