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Anotace knihy

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Plný název: Low Dielectric Constant Materials for IC Applications
• Autor: Paul S. Ho, Wei William Lee, Jihperng Leu
• Jazyk: Angličtina
• Vazba: Brožovaná
• Počet stran: 310
• EAN: 9783642632211
• ISBN: 3642632211
• ID: 07002286
• Nakladatelství: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
• Hmotnost: 510 g
• Rozměry: 235 × 155 × 19 mm
• Datum vydání: 04. October 2012

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