Mohlo by se vám také líbit

Informovat o naskladnění knihy

Více informací o knize High Performance Design Automation For Multi-chip Modules And Packages

• Parametry knihy
• Anotace
• Oblíbené z jiného soudku

Nákupem získáte 239 bodů

Anotace knihy

Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Plný název: High Performance Design Automation For Multi-chip Modules And Packages
• Autor: Paul D Franzon
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 264
• EAN: 9789810223076
• ISBN: 9810223072
• ID: 05065166
• Nakladatelství: World Scientific Publishing Co Pte Ltd
• Hmotnost: 359 g
• Datum vydání: 06. January 1996

Oblíbené z jiného soudku

---

---

---