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Více informací o knize Electronic Packaging Materials Science X: Volume 515

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Anotace knihy

Advanced packaging applications are demanding increasingly more innovative materials sets in order to ensure overall package reliability. In addition, as we migrate towards higher-density inter-connects, the assembly operation will require new processes and process materials to guarantee both performance and manufacturability. This book explores the questions of materials, processes and reliability for high-density package solutions. The book is strengthened by invited and contributed papers from a host of national and international experts. Topics include: interfacial adhesion behavior; flip-chip interconnections; high-density substrates; thermomechanical behavior and packaging reliability issues.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Technology: general issues Technical design

• Plný název: Electronic Packaging Materials Science X: Volume 515
• Autor: Daniel J. BeltonMichael GaynesElizabeth G. JacobsRaymond Pearson
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 262
• EAN: 9781558994218
• ISBN: 1558994211
• ID: 02060166
• Nakladatelství: Materials Research Society
• Hmotnost: 614 g
• Rozměry: 234 × 157 × 23 mm
• Datum vydání: 01. October 1998

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