Mohlo by se vám také líbit

Více informací o knize Electronic Packaging for High Reliability, Low Cost Electronics

• Parametry knihy
• Anotace
• Oblíbené z jiného soudku

Nákupem získáte 353 bodů

Anotace knihy

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Plný název: Electronic Packaging for High Reliability, Low Cost Electronics
• Autor: Rao R. Tummala, Marija Kosec, W. Kinzy Jones, Darko Belavic
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 296
• EAN: 9780792352181
• ISBN: 0792352181
• ID: 01395791
• Nakladatelství: Springer
• Hmotnost: 1360 g
• Rozměry: 235 × 155 × 21 mm
• Datum vydání: 29. February 2000

Oblíbené z jiného soudku

---

---

---