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Více informací o knize Electronic Packaging for High Reliability, Low Cost Electronics

• Parametry knihy
• Anotace
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Anotace knihy

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Plný název: Electronic Packaging for High Reliability, Low Cost Electronics
• Autor: Rao R. Tummala, Marija Kosec, W. Kinzy Jones, Darko Belavic
• Jazyk: Angličtina
• Vazba: Brožovaná
• Počet stran: 296
• EAN: 9789048150854
• ISBN: 904815085X
• ID: 01973862
• Nakladatelství: Springer
• Hmotnost: 474 g
• Rozměry: 240 × 160 × 17 mm
• Datum vydání: 02. December 2010

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