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Anotace knihy

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Plný název: Assembly and Reliability of Lead-Free Solder Joints
• Autor: John H. Lau, Ning-Cheng Lee
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 552
• EAN: 9789811539190
• ID: 25826473
• Nakladatelství: Springer, Berlin
• Hmotnost: 906 g
• Rozměry: 32 × 158 × 33 mm
• Rok vydání: 2020

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