Kód: 07181188
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital inform ... celý popis
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This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Technology: general issues Engineering: general
4567 Kč
Osobní odběr Praha, Brno a 12903 dalších
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