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Více informací o knize Advanced Metallization Conference 2005 (AMC 2005): Volume 21

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• Anotace
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Anotace knihy

Technical leaders from around the world gather here to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, advanced packaging and vertical integration. Both current state-of-the-art and ongoing challenges associated with multilevel interconnect are addressed. Included are papers on the latest developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the understanding of means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Additional contributions discuss the design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Industrial chemistry & manufacturing technologies Metals technology / metallurgy

• Plný název: Advanced Metallization Conference 2005 (AMC 2005): Volume 21
• Autor: S. H. BrongersmaT. C. TaylorM. TsujimuraK. Masu
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 782
• EAN: 9781558998650
• ISBN: 1558998659
• ID: 02060427
• Nakladatelství: Materials Research Society
• Hmotnost: 1160 g
• Rozměry: 235 × 160 × 44 mm
• Datum vydání: 01. January 2006

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