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Více informací o knize Advanced Metallization Conference 1999 (AMC 1999): Volume 15

• Parametry knihy
• Anotace
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Anotace knihy

The revolution in materials and processes for IC metallization presents exciting challenges for the future. This book, the 16th in a popular series from MRS, provides a forum within the IC metallization community, across industrial, academic and government institutions, for presentation and discussion of leading-edge research, development and technology. In particular, the volume focuses on Cu and low-k dielectrics spanning materials, properties, processing, integration and reliability. Two keynote addresses are featured - one on 'The MARCO/DARPA Interconnect Focus Cente' a cooperative research program involving several top universities in the U.S. whose mission it is to explore new interconnect strategies for the future, the other on 'Low-Cost and High-Performance DRAM Technology'. Additional topics include: integration of damascene architectures; copper-deposition processes and properties; barriers for copper; low-k dielectrics; aluminum, tungsten and DRAM metallization; silicides; CMP/cleaning/etching; process modeling and reliability.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Plný název: Advanced Metallization Conference 1999 (AMC 1999): Volume 15
• Autor: M. E. GrossT. GessnerN. KobayashiY. Yasuda
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 763
• EAN: 9781558995390
• ISBN: 1558995390
• ID: 02060265
• Nakladatelství: Materials Research Society
• Hmotnost: 1136 g
• Rozměry: 234 × 165 × 46 mm
• Datum vydání: 01. January 2000

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