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Anotace knihy

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Plný název: 3D Stacked Chips
• Podnázev: From Emerging Processes to Heterogeneous Systems
• Autor: IBRAHIM AB ELFADEL
• Jazyk: Angličtina
• Vazba: Brožovaná
• Počet stran: 339
• EAN: 9783319793054
• ISBN: 9783319793054
• ID: 19684593
• Nakladatelství: Springer International Publishing AG
• Hmotnost: 5504 g
• Rozměry: 235 × 155 × 20 mm
• Datum vydání: 26. May 2018

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