Mohlo by se vám také líbit

Více informací o knize 3D Microelectronic Packaging

• Parametry knihy
• Anotace
• Oblíbené z jiného soudku

Nákupem získáte 477 bodů

Anotace knihy

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Parametry knihy

• Plný název: 3D Microelectronic Packaging
• Podnázev: From Fundamentals to Applications
• Autor: Deepak Goyal, Yan Li
• Jazyk: Angličtina
• Vazba: Brožovaná
• Počet stran: 463
• EAN: 9783319830865
• ID: 20093218
• Nakladatelství: Springer International Publishing AG
• Hmotnost: 724 g
• Rozměry: 235 × 155 × 26 mm
• Datum vydání: 13. July 2018

---

---

---