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Více informací o knize Semiconductor Advanced Packaging

• Parametry knihy
• Anotace
• Oblíbené z jiného soudku

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Anotace knihy

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Plný název: Semiconductor Advanced Packaging
• Autor: John H. Lau
• Jazyk: Angličtina
• Vazba: Brožovaná
• Počet stran: 498
• EAN: 9789811613784
• ID: 39124513
• Nakladatelství: Springer Verlag, Singapore
• Hmotnost: 789 g
• Rozměry: 235 × 155 × 28 mm
• Datum vydání: 19. May 2022

Oblíbené z jiného soudku

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