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Více informací o knize Materials Reliability in Microelectronics V: Volume 391

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Anotace knihy

This long-standing proceedings series is highly regarded as a premier forum for the discussion of microelectronics reliability issues. In this fifth book, emphasis is on the fundamental understanding of failure phenomena in thin-film materials. Special attention is given to electromigration and mechanical stress effects. The reliability of thin dielectrics and hot carrier degradation of transistors are also featured. Topics include: modeling and simulation of failure mechanisms; reliability issues for submicron IC technologies and packaging; stresses in thin films/lines; gate oxides; barrier layers; electromigration mechanisms; reliability issues for Cu metallizations; electromigration and microstructure; electromigration and stress voiding in circuit interconnects; and resistance measurements of electromigration damage.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Plný název: Materials Reliability in Microelectronics V: Volume 391
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 523
• EAN: 9781558992948
• ISBN: 1558992944
• ID: 02060054
• Nakladatelství: Materials Research Society
• Hmotnost: 886 g
• Rozměry: 234 × 157 × 33 mm
• Datum vydání: 24. October 1995

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