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• Anotace
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Anotace knihy

This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Plný název: Manufacturing Challenges in Electronic Packaging
• Autor: Y.C. Lee, W.T. Chen
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 261
• EAN: 9780412620300
• ISBN: 0412620308
• ID: 01386673
• Nakladatelství: Chapman and Hall
• Hmotnost: 1250 g
• Rozměry: 235 × 155 × 20 mm
• Datum vydání: 31. December 1997

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