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Více informací o knize Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

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Anotace knihy

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. §Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Energy technology & engineering Electrical engineering

• Plný název: Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
• Autor: Erdogan Madenci, Ibrahim Guven, Bahattin Kilic
• Jazyk: Angličtina
• Vazba: Brožovaná
• Počet stran: 185
• EAN: 9781461349891
• ISBN: 1461349893
• ID: 06796145
• Nakladatelství: Springer, Berlin
• Hmotnost: 326 g
• Rozměry: 235 × 155 × 11 mm
• Datum vydání: 13. March 2013

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