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Více informací o knize Electronic Packaging Materials Science IX: Volume 445

• Parametry knihy
• Anotace
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Anotace knihy

While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Plný název: Electronic Packaging Materials Science IX: Volume 445
• Autor: S. K. GroothuisP. S. HoK. IshidaT. Wu
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 322
• EAN: 9781558993495
• ISBN: 1558993495
• ID: 02060103
• Nakladatelství: Materials Research Society
• Hmotnost: 614 g
• Rozměry: 234 × 157 × 23 mm
• Datum vydání: 20. October 1997

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