Kód: 06684927
Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit bo ... celý popis
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Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.
Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering
6077 Kč
Osobní odběr Praha, Brno a 12903 dalších
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