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Více informací o knize Electrical Conductive Adhesives with Nanotechnologies

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• Anotace
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Anotace knihy

Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Plný název: Electrical Conductive Adhesives with Nanotechnologies
• Autor: C. P. Wong, Yi Li, Daniel Lu
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 437
• EAN: 9780387887821
• ISBN: 0387887822
• ID: 01383357
• Nakladatelství: Springer-Verlag New York Inc.
• Hmotnost: 822 g
• Rozměry: 243 × 165 × 33 mm
• Datum vydání: 01. September 2009

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