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Více informací o knize Carbon Nanotubes for Interconnects

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Anotace knihy

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Plný název: Carbon Nanotubes for Interconnects
• Podnázev: Process, Design and Applications
• Autor: Aida Todri-Sanial, Jean Dijon, Antonio Maffucci
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 333
• EAN: 9783319297446
• ISBN: 3319297449
• ID: 02910177
• Nakladatelství: Springer International Publishing AG
• Hmotnost: 6447 g
• Rozměry: 235 × 155 × 24 mm
• Datum vydání: 09. July 2016

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