Kód: 06668935
Answers questions frequently asked by thermal and packaging engineers. Providing problem-solving analyses, this title covers theoretical, numerical, and experimental analyses, includes descriptions of 12 air cooling enhancement te ... celý popis
Nákupem získáte 231 bodů
Answers questions frequently asked by thermal and packaging engineers. Providing problem-solving analyses, this title covers theoretical, numerical, and experimental analyses, includes descriptions of 12 air cooling enhancement techniques, and discusses the limiting roles of heat transfer, fluid flow, and thermal coupling in electronic enclosures.
Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering
2305 Kč
Osobní odběr Praha, Brno a 12903 dalších
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