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Více informací o knize Advanced Metallization Conference 2008 (AMC 2008): Volume 24

• Parametry knihy
• Anotace
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Anotace knihy

The Advanced Metallization Conference - held in San Diego, California, and Tokyo, Japan - marked its 25th anniversary in 2008. These two sister conferences form a unique “one conference at two sites” that focuses on the latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. A keynote address by Gary Patton, vice president, IBM Systems and Technology Group, on 'Leading-edge Silicon Technology through Innovation and Collaboration', is featured. Additional topics include: integration; metallization; materials and characterization; CMP and cleaning; 3D integration and packaging; low-k materials; and reliability and yield.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Plný název: Advanced Metallization Conference 2008 (AMC 2008): Volume 24
• Autor: M. NaikR. ShavivT. YodaK. Ueno
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 769
• EAN: 9781605111254
• ISBN: 1605111252
• ID: 02060482
• Nakladatelství: Materials Research Society
• Hmotnost: 1150 g
• Rozměry: 235 × 158 × 43 mm
• Datum vydání: 01. January 2009

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