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Více informací o knize Advanced Metallization Conference 2006 (AMC 2006): Volume 22

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Anotace knihy

The Advanced Metallization Conference 2006 - held in Tokyo and San Diego, California - highlights both current state-of-the-art and ongoing challenges associated with multilevel interconnects. Technical leaders from around the world gathered to discuss developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Contributions to the volume focus on design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices. A keynote address by H.-S. Philip Wong, Stanford University, on 'Nanostructured Materials for Interconnects' is featured.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Plný název: Advanced Metallization Conference 2006 (AMC 2006): Volume 22
• Autor: S. W. RussellM. E. MillsA. OsakiT. Yoda
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 715
• EAN: 9781558999473
• ISBN: 1558999477
• ID: 02060441
• Nakladatelství: Materials Research Society
• Hmotnost: 1070 g
• Rozměry: 235 × 158 × 41 mm
• Datum vydání: 01. January 2007

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