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Více informací o knize Advanced Metallization Conference 2000 (AMC 2000): Volume 16

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Anotace knihy

This book focuses on recent work in on-chip interconnects and other aspects of advanced metallization. In particular, the concentration for this year's volume is on the rapid advances in copper and low-K. The volume is divided into nine parts: Part I contains an invited perspective on the state of semiconductor research and development in Japan; Part II focuses on performance aspects of interconnect architectures; Part III includes some of the most significant recent advances in copper/low-K integration; Part IV is an in-depth collection of electrochemical and chemical processes, mainly pertaining to copper; Part V contains state-of-the-art papers on thin-film diffusion barriers, again mainly for copper wiring; Part VI covers reliability engineering and results; Part VII is a collection of alternative and novel processes and systems related to circuit interconnection; Part VIII contains papers on specific low-K dielectrics and their properties, and new methods for their characterization; and Part IX covers continuing advances in the Al(Cu)/W metallization system.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Plný název: Advanced Metallization Conference 2000 (AMC 2000): Volume 16
• Autor: D. EdelsteinG. DixitY. YasudaT. Ohba
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 706
• EAN: 9781558995741
• ISBN: 1558995749
• ID: 02060289
• Nakladatelství: Materials Research Society
• Hmotnost: 1091 g
• Rozměry: 231 × 163 × 43 mm
• Datum vydání: 01. March 2002

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