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Více informací o knize Sensing, Modeling and Simulation in Emerging Electronic Packaging International Mechanical Engineering Congress and Exposition, Atlanta, Georgia, Nov

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Anotace knihy

Presents 15 papers from the November 1996 congress reflecting the state-of-the-art modeling, simulation, and sensing technologies used in emerging electronic packaging applications, especially flip chip and ball grid array (BGA). Subjects include curing analysis of a flip- chip-on-board electronic p

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Plný název: Sensing, Modeling and Simulation in Emerging Electronic Packaging International Mechanical Engineering Congress and Exposition, Atlanta, Georgia, Nov
• Jazyk: Angličtina
• Vazba: Brožovaná
• Počet stran: 132
• EAN: 9780791815489
• ISBN: 9780791815489
• ID: 06375591
• Nakladatelství: American Society of Mechanical Engineers,U.S.
• Datum vydání: 15. November 1996

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