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Více informací o knize Reliability, Stress Analysis, and Failure Prevention Issues in Adhesive and Bolted Connections - 1999

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• Anotace
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Anotace knihy

Contains the 16 papers presented at the November 1999 symposium. The topics include temperature distribution in a VLSI chip due to dynamic power density, the strength of joints combining adhesives with bolts, optimization of adhesively bonded single lap joints by adhered notching, and estimation of

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Mechanical engineering & materials

• Plný název: Reliability, Stress Analysis, and Failure Prevention Issues in Adhesive and Bolted Connections - 1999
• Jazyk: Angličtina
• Vazba: Brožovaná
• EAN: 9780791816592
• ISBN: 9780791816592
• ID: 06370948
• Nakladatelství: American Society of Mechanical Engineers,U.S.
• Datum vydání: 15. October 1999

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